深圳市勤思达科技有限公司

型号：74HC164D
制造商：NXP
描述：8-bit serial-in, parallel-out shift register 
产品种类：计数器移位寄存器
计数顺序：Serial to Parallel
电路数量：1
封装 / 箱体：SOT-14
逻辑系列：HC
逻辑类型：CMOS
输入线路数量：2
传播延迟时间：170 ns, 34 ns, 29 ns
工作温度：+ 125 C
工作温度：- 40 C
封装：Bulk
功能：Shift Register
安装风格：SMD/SMT
输出线路数量：8
工作电源电压：5 V
工厂包装数量：57
Supply Voltage - Max：6 V
Supply Voltage - Min：2 V
零件号别名：74HC164D,652

Gated serial data inputs

■ Asynchronous master reset

■ Complies with JEDEC standard no. 7A

■ ESD protection:

◆ HBM EIA/JESD22-A114-B exceeds 2000 V

◆ MM EIA/JESD22-A115-A exceeds 200 V.

■ Multiple package options

■ Specified from −40 °C to +85 °C and −40 °C to +125 °C.

[1] CPD is used to determine the dynamic power dissipation (PD in μW).

PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where:

fi = input frequency in MHz

fo = output frequency in MHz

N = number of inputs switching

∑ (CL × VCC2 × fo) = sum of outputs

CL = output load capacitance in pF

VCC = supply voltage in Volts

[2] For HC the condition is VI = GND to VCC.

[3] For HCT the condition is VI = GND to VCC − 1.5 V.

74HC164N −40 °C to +125 °C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1

74HC164D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width

3.9 mm; body thickness 1.47 mm

SOT108-2

74HC164DB −40 °C to +125 °C SSOP14 plastic shrink small outline package; 14 leads; body

width 5.3 mm

SOT337-1

74HC164PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body

width 4.4 mm

SOT402-1

74HCT164N −40 °C to +125 °C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1

74HCT164D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width

3.9 mm; body thickness 1.47 mm

SOT108-2