深圳市勤思达科技有限公司

74HC74N 40 C to +125 C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1

74HCT74N

74HC74D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width

3.9 mm

SOT108-1

74HCT74D

74HC74DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body

width 5.3 mm

SOT337-1

74HCT74DB

 Input levels:

 For 74HC74: CMOS level

 For 74HCT74: TTL level

 Symmetrical output impedance

 Low power dissipation

 High noise immunity

 Balanced propagation delays

 Specified in compliance with JEDEC standard no. 7A

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 Multiple package options

 Specified from 40 C to +85 C and from 40 C to +125 C